Use the promo code 14068086 in the banner to register and secure your free Expo Pass - then book your meeting with CRP USA.
CRP USA will reinforce its presence in the North American aerospace, defense and autonomy sectors through participation in key U.S. industry events in spring 2026. The first is Rapid+TCT 2026, taking place April 14-16, 2026 at the Thomas M. Menino Convention & Exhibition Center in Boston, Massachusetts.
CRP USA will exhibit at booth 2443-3 within the America Makes Pavilion, a collective exhibition area bringing together member organizations of the United States’ leading public-private partnership for additive manufacturing technology and education. Managed by the National Center for Defense Manufacturing and Machining (NCDMM) and sponsored by the U.S. Department of Defense Manufacturing Innovation Institute, America Makes promotes the adoption of additive manufacturing technologies to strengthen U.S. manufacturing competitiveness.
At booth 2443-3, CRP USA will showcase its Selective Laser Sintering (SLS) additive manufacturing solutions using Windform high-performance composite materials, developed by CRP Technology. These carbon or glass fiber-reinforced thermoplastic composites combine lightweight properties with high mechanical strength, thermal resistance and vibration damping, making them particularly suitable for demanding aerospace and defense applications.
Visitors to the CRP USA booth will be able to explore functional, 3D-printed components in Windform, including structural parts designed for UAV platforms, aerospace systems and advanced mobility applications.
These examples demonstrate how industrial SLS 3D printing and advanced manufacturing materials can support accelerated product development, from functional prototyping to low-volume production of flight-ready components.
Engineers, program managers and industry professionals attending Rapid+TCT 2026 are invited to visit CRP USA at booth 2443-3 to discover how Windform composite materials and industrial SLS additive manufacturing can support next-generation aerospace and defense applications.
